Xiaomi Mix Flip global launch nears; Xiaomi Mix Fold 4 and Honor Magic V3 hardware tipped
Xiaomi and Honor foldables are expected to launch soon.
Highlights
- The Xiaomi Mix Flip has appeared on Singapore's IMDA database.
- The listing shows the phone would come with 5G network support, NFC, and Wi-Fi connectivity.
- Xiaomi Mix Fold 4 and Honor Magic Magic V3 are tipped to come with Qualcomm Snapdragon 8 Gen 3 chipset.
It looks like the next-generation foldables from Xiaomi, Samsung and Honor are on the verge of debuting soon. One among them is the Xiaomi Mix Flip, which as the name suggests will have a clamshell design like the Galaxy Z Flip lineup. The handset is now spotted on Singapore's IMDA database, revealing some key details. In addition to that tipster DigitalChatStation has spilled some beans on the Xiaomi Mix Fold 4 and Honor Magic V3 foldables.
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Xiaomi Mix Flip foldable
- The Xiaomi Mix Flip foldable has appeared (via) on Singapore's IMDA database and carries a model number 2405CPX3DG. The listing reveals 5G network support, Bluetooth, Wi-Fi, and NFC.
- This comes after the phone appeared on the IMEI database alongside the Xiaomi 14T and Xiaomi 14T Pro. However, no other details were revealed on the certification.
- The flip phone may be powered by the Qualcomm Snapdragon 8 Gen 3 chipset, similar to the Xiaomi 14 lineup.
- The China 3C certification showed there will be 67W fast charging support.
- Interestingly, noted tipster DigitalChatStation claims the Mix Flip would come with two-way satellite connectivity support and allow users to send SOS signals for emergencies.
An earlier leak showed the Xiaomi Mix Flip's rear design, dual camera sensors and two LED flashes. We also see 'Leica' branding for cameras. The top section of the rear panel has a screen, while the bottom of the back panel features a golden finish with the Xiaomi logo. Rumours have it the foldable would come with a 50MP primary sensor with OIS and an Omnivision OV60A 1/2.8-inch sensor with 2x Optical zoom. We might get a 32MP shooter for selfies.
Xiaomi Mix Fold 4 and Honor Magic V3
On the other hand, besides the Mix Flip foldable, the company is also rumoured to be working on another foldable, the Xiaomi Mix Fold 4. This will come as a successor to the Fold 3. A recent leak has suggested that Honor is also working on a foldable, called the Honor Magic V3.
Now, the Xiaomi Mix Fold 4 and Honor Magic V3 hardware details have been tipped, courtesy of DigitalChatStation. They both will come with Qualcomm Snapdragon 8 Gen 3 chipset and 5,000mAh battery capacities. If true, this is a slight bump from the 4800mAh battery on the Mix Fold 3. Currently, the Vivo X Fold 3 Pro holds the title for the largest foldable battery, which has a 5,700mAh capacity.
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Additionally, the tipster revealed the foldable will have a side-mounted fingerprint sensor for security, similar to the predecessor. The Mix Fold 4 could be the slimmest foldable phone upon release, going by the leak. The tipster affirmed that the Fold 4 will feature a 50MP quad-camera setup with a 5x periscope lens. However, the tipster says the camera protrusion will be quite significant on the Xiaomi foldable. While the Honor Magic V3 might have minimal camera bulge.
The Xiaomi Mix Fold 4 is tipped to arrive with a stronger hinge in comparison to previous models and there might be satellite connectivity as well.